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Showing posts from September, 2009

Circuit improves on bias for GaAs FETs

t's important to properly sequence the bias applied to an RF/microwave GaAs FET or a MMIC (monolithic-microwave-IC) amplifier. These devices are extremely sensitive to drain and gate voltage levels as well as to the order in which these biases turn on and off. A GaAs-FET amplifier that uses two bias voltages—a negative supply, V GG , on its gate and a positive supply, V DD , on its drain—requires that V GG be present before the application of V DD . When powering down the amplifier, V DD must go to 0V before V GG changes from its negative value to 0V. Figure 1 shows a commonly used disable circuit found in many voltage-regulator data sheets. The circuit uses a 2N3904 switching transistor to pull the ADJ pin to ground to disable the voltage regulator. The circuit does not set the output of the regulator to 0V but instead sets the output to the regulator's reference voltage, 1.25V. The condition in which a GaAs FET or MMIC has 0V on the gate and 1.25 on the drain can result...

electronic circuit for hobby

Approximately 1 billion people worldwide experience some kind of chronic nasal congestion during sleep. Addressing this major health issue, IMEC (Leuven, Belgium) and research affiliate Holst Centre developed and clinically validated a miniaturized wireless sleep staging system, enabling early screening of abnormal sleep profiles outside of clinics. IMEC’s lightweight, wearable system consists of a headband with three sensor nodes that measure two electroencephalogram (EEG) channels to monitor brain activity, two electrooculogram (EOG) channels to monitor eye activity, and an electromyogram (EMG) channel to monitor chin muscle activity. These five signals provide the required information for sleep staging according to the Rechtschaffen and Kales standard (the R&K standard classifies EEG-sleep recordings). The sensor nodes integrate IMEC’s ultra-low-power biopotential read-out ASIC to amplify and filter the five different signals. Then those signals are wirelessly transmitted to t...

electronic using

What is claimed is: 1. A method of manufacturing an electronic component wherein an insulating coating that is electrically conductive when heated is adhered to a surface of a semiconductor chip except at electrodes, and a tip of each of inner leads of a lead frame is aligned with a corresponding electrode, the method including anodically bonding said inner leads and said insulating coating to each other, thereby electrically connecting said electrodes to said inner leads. Description BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component manufactured using an anodic junction and a method of manufacturing the electronic component and, more particularly, to an electrical contact between a wire and an electrode with an insulating layer surrounding each electrode on a semiconductor chip surface, an electrically conductive surface of each wire being anodically bonded when the wire is simultaneously pressure-joined and connected to an ...