What is claimed is:
1. A method of manufacturing an electronic component wherein an insulating coating that is electrically conductive when heated is adhered to a surface of a semiconductor chip except at electrodes, and a tip of each of inner leads of a lead frame is aligned with a corresponding electrode, the method including anodically bonding said inner leads and said insulating coating to each other, thereby electrically connecting said electrodes to said inner leads.
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an electronic component manufactured using an anodic junction and a method of manufacturing the electronic component and, more particularly, to an electrical contact between a wire and an electrode with an insulating layer surrounding each electrode on a semiconductor chip surface, an electrically conductive surface of each wire being anodically bonded when the wire is simultaneously pressure-joined and connected to an electrode on the semiconductor chip surface.
2. Description of the Related Art
FIG. 39 is a perspective view showing electrodes 2 attached to a surface of a semiconductor chip 1, according to a conventional ultrasonic thermocompression wire bonding method, connected through gold wires 5 to inner leads 4 extending from lead frames, not shown. FIG. 40 is a diagrammatic illustration of one end of the gold wire connected to the electrode 2 on the semiconductor chip 1 by ultrasonic thermocompression bonding.
1. A method of manufacturing an electronic component wherein an insulating coating that is electrically conductive when heated is adhered to a surface of a semiconductor chip except at electrodes, and a tip of each of inner leads of a lead frame is aligned with a corresponding electrode, the method including anodically bonding said inner leads and said insulating coating to each other, thereby electrically connecting said electrodes to said inner leads.
Description
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an electronic component manufactured using an anodic junction and a method of manufacturing the electronic component and, more particularly, to an electrical contact between a wire and an electrode with an insulating layer surrounding each electrode on a semiconductor chip surface, an electrically conductive surface of each wire being anodically bonded when the wire is simultaneously pressure-joined and connected to an electrode on the semiconductor chip surface.
2. Description of the Related Art
FIG. 39 is a perspective view showing electrodes 2 attached to a surface of a semiconductor chip 1, according to a conventional ultrasonic thermocompression wire bonding method, connected through gold wires 5 to inner leads 4 extending from lead frames, not shown. FIG. 40 is a diagrammatic illustration of one end of the gold wire connected to the electrode 2 on the semiconductor chip 1 by ultrasonic thermocompression bonding.
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